PROPERTY
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ISOBOARD® ND
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Thermal Conductivity
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ISOBOARD®'s homogeneous cell structure, skin faces and vapour diffusion prevents any convective motion within the board. This structure also mitigates against any ageing, resulting in a stable long term thermal conductivity of 0.030 W/m.K at 24°C for ND Grade product.
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Resistance to Water and Vapour Penetration
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ISOBOARD® has a closed cell structure with no interstitial space and an outer skin of denser material. This structure combined with the lack of voids and capillaries, ensures that it is almost impossible for water and water vapour to enter the board.
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Compressive Strength
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The cellular structure of ISOBOARD® ensures a relatively high compressive strength. This is dependant on the sheet thickness.
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Fire Behaviour
AS/NZS 3837:1998
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ISOBOARD® contains a flame retardant additive.
Foil faced ISOBOARD® achieves a CLASS 3 Rating under the BCA Specifications A2.4 -tested according to AS/NZS 3837:1998 Cone Calorimeter Test Method. Test Certificate # 7-562032-CV - dated 10 / 09 / 2008
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Dimensional Stability
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The regularity and homogeneity of ISOBOARD®'s cellular composition ensures good dimensional stability.
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Chemical Resistance
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ISOBOARD® is stable and has good resistance to acids, bases, cold bitumen, silicon oils but is unstable to tars, organic solvents, hydrocarbon gasoline and oil-based paints.
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Cutting / Fixing
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ISOBOARD® can easily cut with wood working tools (a wavy blade is preferable), mechanically fixed and bonded with suitable adhesives (e.g. styrene acrylic compounds such as Supa Nails or epoxy compounds such as Araldite, Epoxy Plus).
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Biological Effects
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ISOBOARD® is resistant to bacteria, micro organisms, insect and rodent attack.
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Physical Properties
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ISOBOARD® ND
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Test Method
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Density
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32 -35 kg/m³
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DIN 53420
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Thermal Conductivity
-as manufactured at 4.4ºC test temperature
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0.016 W/m.K
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DIN 52612 or
DIN 52616
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Thermal Conductivity
-laboratory value at 10ºC test temperature
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0.027 W/m.K
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ASTM C177 or
ASTM C518
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Thermal Conductivity
-5 years aged at 24ºC mean temperature
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0.030 W/m.K
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ASTM C177 or
ASTM C518
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Compressive strength at 10% deflection
[ actual result according to sheet thickness ]
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220 -360 kPa
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DIN 53421
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Water vapour diffusion resistance factor
[ actual result according to sheet thickness ]
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100 - 225 u
0.4 - 0.6 Perm inch
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DIN 52615
ASTM C355
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Water vapour permeability
[ actual result according to sheet thickness ]
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0.4 - 0.6 perm inch
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ASTM C 355
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Water absorption by submersion
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0.2 % by vol.
1.00 % by vol.
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DIN 53428
[ 28 day submersion of whole board ]
ASTM D2842
[± 1 % by vol. precision ]
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Capillarity
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Nil
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na
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Linear coefficient of thermal expansion and contraction ( Heat soaking conditions)
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-6
70 x 10 per ºC
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